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Our packaging experience is based in plastic
and ceramic with complete mil-standard certification. Manuflex
is supported through strategic alliances with subcontract
assembly manufacturers throughout the US, Canada, and Asia.
At Manuflex we offer: wafer level gold bumping,
inner lead TAB bonding, plastic, and ceramic packaging. Plastic
package configurations include, but are not limited to, the
following: DIP, SOIC, PLCC, PQFP with heat spreader/slug options,
TQFP, BGA, TSOP, SSOP, and PGAs (and most configurations are
available in ceramic equivalents).
| Bumpered Quad Flatpack (BQFP) |
| Ceramic Leadless Chip Carriers (CLCC) |
| Ceramic Quad Flatpack (CQFP) |
| Pre-J leaded Chip Carrier (Pre-JLDCC) |
| Low Profile Quad Flatpack (LQFP) |
| Metal Quad Flatpack® (M-QUAD) |
| Plastic Ball Grid Array (PBGA) |
| Plastic Leaded Chip Carrier (PLCC) |
| Power Quad 2™ (PQ2) |
| Plastic Quad Flatpack (PQFP) |
| Super Ball Grid Array* (SBGA) |
| Small Outline Integrated Circuit (SOIC) |
| Small Outline J-Lead (SOJ) |
| Shrink Small Outline Package (SSOP) |
| Thin Quad Flatpack (TQFP) |
| Thin Small Outline Package (TSOP) |
| Chip Array Ball Grid Array (CABGA) |
| Fine Pitch Plastic Ball Grid Array (FPBGA) |
| Through Hole |
| Ceramic Pin Grid Array (CPGA) |
| 476-CPGA |
| Plastic Dual-In-Line (P-DIP) |
| Ceramic Dual-In-Line (SBRAZE) |
| Thermal Resistance |
| Surface Mounts |
| Through Holes |
| CPGA-vs-Die |
| CQFP-vs-Die |
| JLDCC-vs-Die |
| PQFP-vs-Die |
| *Available/Not in use yet. Lead-time may
be required. |
Manuflex is committed to meeting your packaging
needs with cost effective solutions. Our product offering
is continually modified. Thus, the above package types are
for reference only.
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